| NO | 项目 | 制程能力 |
| 1 | 层数 | 2-16 |
| 2 | [敏感词]成品尺寸 | 1-2L:630x2100mm Max |
| M/L:630x1250mm Max | ||
| 3 | 过孔/PTH孔环尺寸 | ≥4mil(0.1mm)/5mil(0.13mm) |
| 4 | PTH[敏感词]孔径 | ≤6.5mm |
| 5 | 小线宽l线隙 | 3mi/3mil (0.075mm/0.075mm) |
| 6 | 小内层焊盘 | 4mil (0.1mm) |
| 7 | 薄内层厚度 | 4mil (0.1mm) |
| 8 | 内层铜箔厚度 | 0.5-2.0 0z |
| 9 | 孔铜厚度 | 18-30um |
| 10 | 无铅喷锡锡厚 | 150-1000u'(3.75-25um) |
| 11 | 外层完成铜厚 | 0.5-5.0 0Z |
| 12 | 完成板厚 | 0.2-3.2mm (4L:0.5mm Min) |
| 13 | 板厚公差 | ±10% |
| 14 | 多层板层间对准度 | ±2mil (±50um) |
| 15 | 小钻孔孔径 | 0.15mm |
| 16 | 孔位精度 | ±2mil (±50um) |
| 17 | 孔径公差 | ±2mil (±50um) |
| 18 | 孔电镀[敏感词]纵横比 | 10:1 |
| 19 | 外层PAD对位精度 | 3mil3mil (0.075mm/0.075mm) |
| 20 | 蚀刻公差 | ±10% |
| 21 | 阻焊桥小保留宽度 | 3mil (0.075mm) |
| 22 | 阻焊塞油[敏感词]孔径 | 0.5mm |
| 23 | 表面处理工艺 | HAL/HALLF、ENIG、OSPImmersion Tin、Gold finger |
| 24 | 金手指[敏感词]镀金厚度 | ≤30u'(≤0.75um) |
| 25 | 沉镍金厚度 | Au1-3u" Ni:100-300u |
| 26 | 阻抗控制公差 | ±10% |
| 27 | [敏感词]翘曲度 | ≤0.75% |
